MiJing High Precision BGA Reballing Stencil for iPhone X-14 Series

Features:

- MJ high-quality BGA Reballing Stencil, 100% new brand and high quality.

- Ultra-thin steel template, just 0.12mm thickness, easy to use.

- Laser engraving, Grooves staircase.

- German Craftsmanship, Quick hand, Pinpoint.

- Support for:

iPhone X / XR / XS / XS MAX / 11 / 11 Pro / 11 Pro Max / 12 / 12 Mini / 12 Pro / 12 Pro Max / 13 / 13 Mini / 13 Pro / 13 Pro Max / 14 / 14 Plus / 14 Pro / 14 Pro Max

Notice:

- Please Planting tin net again the chip foot, the temperature of the hot air gun is controlled within 250 degrees.

- The too high temperature is going to make the product deformed, secure with tweezers planting tin net.

- Apply the solder paste evenly, make sure than each hole is covered with solder paste, clean the surface of the steel net with a clean cloth.

- Then blow and weld the ball with a hot air gun, after cooling slightly the steel net tube is separated from the chip.